Our range of semiconductor sealing products offers:
Within semiconductor fabrication, seals are subjected to some of the most demandingchemical media known. These include acid, alkalines,solvents and gases of the most destructive kinds.
Maximizing seal compatibility
Trelleborg Sealing Solutions has concentrated efforts on maximizing the compatibility of standard sealing formulations to media and the development of specialized compounds, such as the Isolast® Fab Range™ of perfluoroelastomer materials.
The Isolast® Fab Range™ of sealing materials is almost universally compatible with all media and gases, as are our leading edge Turcon® PTFE based compounds.
Easy selection of the optimum semiconductor sealing material
To identify the optimum semiconductor sealing material for your application we provide an online tool, the Chemical Compatibility Check.
High-temperature semiconductor wafer processing and plasma applications include Rapid Thermal Processing (RTP), Chemical Vapor Deposition (CVD) and dry plasma etch.
Maximum sealing performance
Seals must withstand temperatures above 300°C / 572°F with main requirements of low outgassing and minimum particle generation. Sealing materials from Trelleborg Sealing Solutions are proven to successfully operate at continuously elevated temperatures while withstanding demanding chemicals and media.
Recommended semiconductor sealing materials and products:
Vacuum technology plays a critical role in semiconductor manufacturing, being key to process yield and productivity. Semiconductor applications range from dry pumps to more complex subsystems for processes such as photolithography. Maintaining a consistent vacuum is vital, as even minor fluctuations can have a negative affect on the whole production cycle.
Sealing solutions proven through rigorous testing
Effective sealing is an important element in achieving consistent vacuum. To identify the optimum seal for this environment Trelleborg Sealing Solutions has undertaken extensive long-term testing to prove a range of sealing solutions that are now effectively operating in vacuum conditions globally.
Semiconductor wet manufacturing process steps include etching, stripping, plating and CMP (Chemical Mechanical Planarization). These are followed by wafer cleaning, removal of all surface contamination of particulates, organics, metallics and native oxides. Plus all liquids used must have extremely high purity.
These chemically intensive semiconductor processes involve wet process chemicals including acids, such as hydrofluoric, alkaline solutions like sodium hydroxide and solvents, typically N-methylpyrrolidone or acetone.
Seals with universal chemical resistanceOptimum seal performance is critical in ensuring maximum uptime throughout the ULSI (ultra large scale integration) process. Trelleborg Sealing Solutions offers semiconductor sealing materials that give almost universal chemical resistance, minimum leach out of ionic impurities and extremely low particulation in wet process applications.